✔ready-to-use, one-component system
✔low module
✔excellent primerless adhesion to many substrates
✔no use of organotin catalysts
✔ Flexible at low (-40 °C) and high temperatures (+180 °C)
✔Flowable
✔Low viscosity
✔Solvent-based
✔ Recommended service temperature from -45 °C to +230 °C
✔ max. recommended short term peak temperature exposure 250°C
✔ non-thixotropic
✔ Flowable
✔ Heat resistant
✔ Low viscosity
✔ One-component
✔ Solvent-free
✔ Suitable for food contact under Regulation (EC) 1935/2004, once fully cured and with appropriate processing
✔ Conditions: no further acetic acid release on food contact, residual solvents removed from the finished article
✔ Does not inhibit the cure of addition silicones
✔ Bonding and coating of silicones
✔ One component, acetoxy curing system
✔ Non slump to self levelling
✔ Excellent adhesion to a range of substrates
✔ Colourless transparent
✔ Electrically insulating
✔ Recommended service temperature -50 to 180 °C
✔ UV and weathering resistant
✔ Bonding, coating and sealing of silicones
✔ One component, acetoxy curing system
✔ Moderately self levelling
✔ Solvent free
✔ Primerless adhesion to glass, ceramics, metals, many plastics and powder coatings
✔ Colourless transparent
✔ High tear resistance
✔ Recommended service temperature -45 to 180 °C, short term peak up to 200 °C
✔ UV and weathering resistant
✔ Recommended operating temperature from -45 °C to +180 °C
✔ Neutral curing (Alkoxy), no acid
✔ Sprayable
✔ Good adhesion to many substrates without primer
✔ One component
✔ Solvent free
✔ Self-Leveling
