Silicone for potting electronics and optical elements

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Exhibition created by Hypar Collective.

Professional silicones for electronics and optical applications

This collection contains silicones for potting, encapsulating, coating and bonding electronic components and optical elements. Silicones provide electrical insulation, stay flexible over a wide temperature range and protect against moisture, vibration and thermal cycling.

Potting and encapsulation silicones (2-component)

  • Wacker Elastosil RT 601 – transparent, 45 Shore A, low viscosity; for potting and optical applications
  • Wacker Elastosil RT 602 – light grey, for potting and encapsulating sensors
  • Wacker Elastosil RT 625 – pourable addition-cure silicone for encapsulation and moulds
  • Addition Silicone Clear 5 and 25 – clear potting silicones in two hardnesses
  • Silpot 00-30 – very soft encapsulation silicone
  • Wacker Elastosil RT 675 (coming soon) – thermally conductive, reddish brown, 80 Shore A, mix ratio 1:1, up to 180 °C; for potting where heat must be dissipated

Silicone gels

  • Wacker SilGel 612 – clear, very soft gel for sensitive electronics and power electronics
  • CHT ALPA-GEL 97166 – platinum-cure gel for electronics and battery modules
  • Addition Silicone Gel 840 Clear and Clear 0 Super Soft – soft, self-healing protection for delicate parts

Coating, sealing and bonding (1-component)

  • Wacker Elastosil A07 Translucent – flowable RTV-1, amine cure; for coating and bonding sensitive electronics
  • Wacker Elastosil N2010 – neutral-cure silicone adhesive for electronics and assembly
  • Wacker Elastosil E41 Transparent – self-levelling with strong adhesion. Note: acetoxy (acetic acid) cure, so do not apply directly to copper or other corrosion-sensitive metals

Silicone foam

  • CHT SilSo Lite 21030 – lightweight platinum silicone foam for potting battery modules (on request)
  • Silicone Foam Closed Cell and Open Cell – lightweight encapsulation, damping and thermal insulation

Primers for better adhesion

  • Wacker Primer G 790 and G 791 – for reliable adhesion of addition-cure silicones to metal, glass and plastic housings

Selection guide: which type suits your application?

TypeHardnessSuitable forProducts
Soft gelPenetration (very soft)Sensitive components, wire-bonded ICs, sensors. Self-healing and repairable: you can probe through it and the gel closes againSilGel 612, ALPA-GEL 97166, Gel 840 Clear, Clear 0
Soft elastomerShore 00 to approx. 10 Shore AVibration damping, PCBs with heavy components, connectorsSilpot 00-30, Clear 5
Elastomer20–45 Shore AMechanical protection, transformers, coils, optical encapsulationRT 601, RT 602, RT 625, Clear 25
1-component (RTV-1)25–40 Shore AThin layers, coating, sealing and bonding without mixingA07, N2010, E41
Silicone foamSoft, low densityWeight saving, battery modules, damping and insulationSilSo Lite 21030, Foam Closed/Open Cell
Thermally conductive elastomerapprox. 80 Shore APower supplies, power electronics and components that need to dissipate heatRT 675 (coming soon)

Cure systems compared

SystemBy-productCorrosive?Note
Addition (platinum), 2KNoneNoUniform cure even in thick sections, faster with heat. Sensitive to inhibition
Condensation (tin), 2KAlcoholNoLess sensitive to inhibition. Do not heat above 90 °C during cure
1K acetoxyAcetic acidYes, on copper and metalsFast with strong adhesion, not directly on electronics (E41)
1K amineAmineLimitedSuitable for sensitive electronics (A07). Inhibits platinum silicones: do not combine with addition systems
1K neutral (alkoxy)AlcoholNoSafest choice for electronics (N2010)

🌡️ Typical properties

  • Temperature range: flexible from approx. -50 °C up to +180 °C continuous; special grades up to +250 °C
  • Thermal conductivity: standard 0.2–0.4 W/m·K; for heat dissipation Elastosil RT 675 will be available soon, other thermally conductive grades on request
  • Dielectric strength: typically 21–23 kV/mm
  • Volume resistivity: 10¹³–10¹⁶ Ω·cm, depending on grade
  • Transparent grades: refractive index approx. 1.40–1.41, UV-resistant and non-yellowing

Exact values differ per product. Always check the technical data sheet (TDS) of the selected product.

Processing tips

  • Weigh and mix accurately: keep to the exact mix ratio and scrape the sides and bottom.
  • Vacuum degassing: for bubble-free potting and optical clarity.
  • Accelerating cure: addition-cure silicones cure faster with heat (Wacker cites e.g. approx. 30 minutes at 140 °C). Consider the temperature resistance of your components.
  • 1K silicones cure with atmospheric moisture, approx. 1–2 mm per day. Use them for thin layers, not for deep potting.
  • Avoiding inhibition: addition-cure (platinum) silicones will not cure in contact with sulphur, tin, amines and some solder residues or coatings. Always test on a small area first.
  • Adhesion: silicones naturally adhere poorly. Clean the surface and use a primer when the silicone must bond to the housing.

Applications

  • Electronics: PCBs, sensors, connectors, power supplies
  • LED lighting: encapsulating LED strips and modules
  • Batteries and e-mobility: encapsulating and damping modules
  • Automotive and industry: control units, sensors, cable glands
  • Optics: clear encapsulation of optical elements

Brochures and selection guides

Need more background? See the manufacturers' brochures and product overviews.

Not sure which product suits your application, or looking for a thermally conductive or flame-retardant grade? Contact us for technical advice.